1 Стандарт пайки IPC. Пайка элементов со штыревыми выводами и

and wires beyond the conductive surface is (L) or as

specified on the specification or drawing. Acceptable - Class 1,2,3
• The leads protrude beyond the land within the specified minimum and maximum (L) of Table 7-2, provided there is no danger of violating minimum electrical clearance.

Table 7-2 Protrusion of Leads in Unsupported Holes

Defect - Class 1,2,3
• Lead protrusion does not meet Table 7-2 requirements.
• Lead protrusion violates minimum electrical clearance.
• Lead protrusion exceeds maximum design height requirements.

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the board and direction of the clinch is along the

connecting conductor.

Acceptable - Class 1,2,3
• The clinched lead does not violate the minimum electrical clearance (C) between noncommon conductors.
• The protrusion (L) beyond the land is not greater than the similar length allowed for straight-through leads.
• The leads protrude beyond the land within the specified minimum and maximum (L) of Table 7-2, provided there is no violation of minimum electrical clearance.
Acceptable - Class 3
• Lead in unsupported hole is clinched a minimum of 45°. Defect - Class 1,2,3
• The lead is clinched toward an electrically noncommon conductor and violates minimum electrical clearance (C).
• Lead protrusion is insufficient for clinch, if required.

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lead), covered with wetted solder and outline of lead discernible

in the solder fillet.
• No void areas or surface imperfections.
• Lead and land are well wetted.
• Lead is clinched.
• 100% solder fillet around lead.

Table 7-3 Unsupported Holes with Component Leads, Minimum Acceptable Conditions3

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100% fill.
Acceptable - Class 1,2,3 • Minimum 75% fill. A

maximum of 25% total depression, including both secondary and primary sides is permitted.

Defect - Class 2,3
• Vertical fill of hole is less than 75%.

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width is equal to component termination width or width of

land, whichever is less.

Acceptable - Class 1,2
• End joint width (C) is minimum 50% of component termination width (W) or 50% land width (P), whichever is less.

Acceptable - Class 3
• End joint width (C) is minimum 75% of component termination (W) or 75% land width (P), whichever is less.

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height is the solder thickness plus component termination height.
Я Acceptable

- Class 1,2,3
• Maximum fillet height (E) may overhang the land and/or extend onto the top of the end cap metallization, but not extend further onto the top of component body.
Defect - Class 1,2,3
• Solder fillet extends onto the top of the component body

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on the vertical surface(s) of the component termination.
Acceptable - Class

3
• Minimum fillet height (F) is solder thickness (G) plus 25% termination height (H), or 0.5 mm [0.02 in], whichever is less.

Defect - Class 1,2
• No fillet height evident on face of component.
Defect - Class 3
• Minimum fillet height (F) is less than solder thickness (G) plus 25% (H), or solder thickness (G) plus 0.5 mm [0.02 in], whichever is less.

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- Class 1,2
• Maximum overhang (A) is not greater

than 50% lead width
(W) or 0.5 mm [0.02 in], whichever is less. Acceptable - Class 3
• Maximum overhang (A) is not greater than 25% lead width
(W) or 0.5 mm [0.02 in], whichever is less.

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fillet along full length of lead.
Acceptable - Class 1
•

Minimum side joint length (D) is equal to lead width (W) or 0.5 mm [0.02 in], whichever is less (not shown).
Acceptable - Class 2,3
• When foot length (L) is greater than three (W), minimum side joint length (D) is equal to or greater than three lead widths (W), Figure 8-83.
• When foot length (L) is less than three (W), (D) is equal to
75% (L), Figure 8-84. 18

extends above lead thickness but does not fill upper lead

bend.
• Solder does not contact the component body

Acceptable - Class 1,2,3
• Solder touches a plastic SOIC or SOT component.
• Solder does not touch ceramic or metal component.
Acceptable - Class 1 Defect - Class 2,3
• Solder touches the body of a plastic component, except for SOICs and SOTs.
• Solder touches the body of a ceramic or metal component.

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or stress fractures.
Acceptable - Class 1,2
• Nicks or chip-outs

not greater than dimensions stated in Table 9-1, each considered separately.

Table 9-1 Chip-Out Criteria

Defect - Class 1,2 (Figures 9-22 - 27)
• Any nick or chip-out that exposes the electrodes.
• Cracks, nicks or any type of damage in glass bodied components.
• Any chip-outs in resistive elements.
• Any cracks or stress fractures.
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• Damage in excess of Table 9-1.

and exhibits good
wetting of the solder to the parts being

joined.
• Outline of the lead is easily determined.
• Solder at the part being joined creates a feathered edge.
• Fillet is concave in shape.

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