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1 Стандарт пайки IPC. Ориентация элементов, формовка выводов при монтаже на

OrientationTargetAcceptableDefect2

Слайды и текст этой презентации

Слайд 11
Стандарт пайки IPC.
Ориентация элементов, формовка выводов
при монтаже на печатную плату
Часть

1Стандарт пайки IPC.Ориентация элементов, формовка выводовпри монтаже на печатную платуЧасть 1

Слайд 2Orientation
Target
Acceptable
Defect
2

OrientationTargetAcceptableDefect2

Слайд 3Orientation
Target
Defect
Acceptable
3

OrientationTargetDefectAcceptable3

Слайд 4Lead Forming
Table* 7-1 Minimum Iraida Band Radius
4

Lead FormingTable* 7-1 Minimum Iraida Band Radius4

Слайд 5Leads Crossing Conductors
Acceptable - Class 1,2,3
• Sleeve does not

interfere with formation of the required solder connection (A).

Sleeve covers area of protection designated (B)

Acceptable - Class 1
• Unsleeved component lead crossing an electrically noncommon conductor that does not violate electrical spacing (B).
Defect - Class 2,3
• Splitting and/or unraveling of sleeving (A).
• A component lead crossing an electrically noncommon conductor with a clearance of less than 0.5 mm [0.020 in] with no separating insulator (lead sleeving or surface coating) (B). Defect - Class 1,2,3
• Component leads and wires specified to have sleeving are not sleeved.
• Damaged/insufficient sleeving no longer provides protection from shorting.
• Sleeving interferes with formation of the required solder con nection.

5

Leads Crossing ConductorsAcceptable - Class 1,2,3•  Sleeve does not interfere with formation of the required solder

Слайд 6DIP/SIP Devices and Sockets
Target - Class 1,2,3
• Standoff step

on all leads rests on the land
• Lead protrusion

meets requirements

Target

Acceptable

Defect

6

DIP/SIP Devices and SocketsTarget - Class 1,2,3•  Standoff step on all leads rests on the land•

Слайд 7Axial Leaded
Target - Class 1,2,3
• The entire body length

of the component is in contact with the board surface.

Components required to be mounted off the board are at least 1.5 mm [0.059 in] from the board surface; e.g., high heat dissipating.

Acceptable - Class 1,2
• The maximum clearance (C) between the component and the board surface does not violate the requirements for lead protrusion (see 7.5.3) or component height (H). (H) is a user determined dimension.
Acceptable - Class 3
• Clearance (C) between the component body and the board does not exceed 0.7 mm [0.028 in].

7

Axial LeadedTarget - Class 1,2,3•  The entire body length of the component is in contact with

Слайд 8Axial Leaded
Target - Class 1,2,3
• The clearance (C) of

the component body or weld bead above the land is

1 mm [0.039 in].
• The component body is perpendicular to the board.
• The overall height does not exceed the height specified.

Table 7-4 Component to Board Clearance

8

Axial LeadedTarget - Class 1,2,3•  The clearance (C) of the component body or weld bead above

Слайд 9Radial Leads - Horizontal
Target - Class 1,2,3
• The component body

is in flat contact with the board's surface.
Acceptable - Class

1,2,3 • Component in contact with board on at least one side and/or surface.

Defect - Class 1,2,3
• Unbonded component body not in contact with mounting surface.

9

Radial Leads - HorizontalTarget - Class 1,2,3• The component body is in flat contact with the board's

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