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TEM Transmision Electrom Microscope Construction and Application

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Plan of presentationIntroduction,Selected parts of construction,Electron gun,Lenses,Specimen holder,Image registration,Detectors – different types

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Слайд 1TEM Transmision Electrom Microscope Construction and Application







Prof. dr habil. ing. Włodzimierz Dudziński

TEM Transmision Electrom Microscope  Construction and ApplicationProf. dr habil. ing. Włodzimierz Dudziński

Слайд 2Plan of presentation
Introduction,
Selected parts of construction,
Electron gun,
Lenses,
Specimen holder,
Image registration,
Detectors –

different types

Plan of presentationIntroduction,Selected parts of construction,Electron gun,Lenses,Specimen holder,Image registration,Detectors – different types

Слайд 3Initial information
Sample image is magnified at formed by electron beam
It

is used for investigation of specime internal structure
Maximale thicknes

of specimen can be 0,1 µm
Applied acceleration voltages are from 100kV up to 3 mV ( 3 milion V)
Exploitation is very expensive kosztów



Initial informationSample image is magnified at formed by electron beamIt is used for investigation of specime internal

Слайд 4Surface of Cu deposite - example






A) SEM

B) TEM

Surface of Cu deposite - example A) SEM

Слайд 5Application
Presentation of specimens internal structure
Images are not coloured
Application at

materials science, biology, medicine and geology
Microstructure, crystalographic orientation, atomic resolution,

chemical composition of different phases can be investigated (HREM, EDX, EELS)
3D imaging of specimen is possible (STEM)
Application Presentation of specimens internal structureImages are not colouredApplication at materials science, biology, medicine and geologyMicrostructure, crystalographic

Слайд 6Basic construction of TEM
Column:
Electron gun
Lenses
Specimen
Screen / CCD camera
Registration systems
Additional

equipments (vacuum system, power supplyiers,high voltage system + many of

another different)


Basic construction of TEMColumn:Electron gunLenses SpecimenScreen / CCD cameraRegistration systemsAdditional equipments (vacuum system, power supplyiers,high voltage system

Слайд 7TEM situation at laboratory room

TEM situation at laboratory room

Слайд 9Electron gun
Aim: electron beam emision and initial formation
Acceleration

voltage : typical 100 – 400 kV (up to 3

MV –HVTEM)
Electron gun Aim: electron beam emision and initial formation Acceleration voltage : typical 100 – 400 kV

Слайд 10Electron gun

Electron gun

Слайд 11Properties of electron guns different types

Properties of electron guns different types

Слайд 12Electron gun - thermoemission

Electron gun - thermoemission

Слайд 13Electron gun with auto-positioning anode

Electron gun  with auto-positioning anode

Слайд 14Electron gun – cathode types

Electron gun – cathode types

Слайд 15Electromagnetic lenses at TEM
Are used for changing characteristic of electron

beam
Brightness
Concentration
Focusing
Are constructed like coils of coper wires

Electromagnetic lenses at TEMAre used for changing characteristic of electron beam BrightnessConcentrationFocusingAre constructed like coils of coper

Слайд 16Condensor system
Forms electron beam, changing their brightness and diameter
Is formed

by two electromagnetic lenses + condenser diaphragme which cuts some

parts of dispersed electrons
Condensor systemForms electron beam, changing their brightness and diameterIs formed by two electromagnetic lenses + condenser diaphragme

Слайд 17Condenser lenses
Lens C1:
Decreaese beam diameter
Control the electron beam cross over

Lens

C2:
Control of beam dispersion and ilumination of specimen surface

Condenser lensesLens C1:Decreaese beam diameterControl the electron beam cross overLens C2:Control of beam dispersion and ilumination of

Слайд 18Condenser aperture
Eliminate electrons dispersed to much
Protect the specimen against excessive

radiation

Condenser apertureEliminate electrons dispersed to muchProtect the specimen against excessive radiation

Слайд 19Specimen chamber
Very high precission of specimen movement, along X, Y

and Z direction (up to 1µm). Very high stabilisation is

necessary
Additionally mounted equipment:
- Goniometer – allows specimen tilting and rotation
- Heating device – on line structure observation during
heating time
- Cooling device – used for biological specimens and
protections against contamination – liquid nitrogen is
applied
- X-ray, EELS or Auger spectrometers (STEM)

Specimen chamberVery high precission of specimen movement, along X, Y and Z direction (up to 1µm). Very

Слайд 20Specimen chamber – obiective polepiece

Specimen chamber – obiective polepiece

Слайд 21 Types of specimen holders

Types of specimen holders

Слайд 22Types of specimen holders

Types of specimen holders

Слайд 23Specimens storage

Specimens storage

Слайд 24Komora preparatu
Viewing
Screen

Komora preparatuViewingScreen

Слайд 25Contamination
Negative phenomenon – the rest of silicon oil

vapeurs deriving from cacuum pumps are sedimented on the specimen

surface and borders of apertures. This phenomenon can heavy decrease contrast and resolution of images.
Protection:
Instalation of anti contamination device inside TEM column – i.e. ring or „cold fingers” sourrounded specimen - cooled by liquid nitrogene
Increasing of vacuum quality by application „Cold Trap” and „oil free” pomps like: Ion Getter Pump (IGP) or Turbo Molecular Pump (TMP).
Contamination  Negative phenomenon – the rest of silicon oil vapeurs deriving from cacuum pumps are sedimented

Слайд 26Contamination

Contamination

Слайд 27Position of „Cold Finger” in respect to specimen holder

Position of „Cold Finger” in respect to specimen holder

Слайд 28Pouring liquid nitrogen

Pouring liquid nitrogen

Слайд 29Vacuum system
Vacuum is necessary that gas molecules do not interfere

with the course of the electron beam
Necessary condition: high vacuum

(10-4 - 10-5 Pa),
Vaccum is obtained by the system of rotary (RP) and oil diffusion pomps (DP) or TMP or IGP.
Turbo Molecular Pumps (TMP) and Ion Getter Pumps (IGP) don’t contain oilacji)
The lock is used to paste samples into specimen chamber without column aeration
Vacuum systemVacuum is necessary that gas molecules do not interfere with the course of the electron beamNecessary

Слайд 30Vacuum system - valves

Vacuum system - valves

Слайд 31Vacuum system - rotary pump
Reached vacuum:
10-2 Pa

Vacuum system - rotary pumpReached vacuum:10-2 Pa

Слайд 32Vacuum system – diffusion pump
Reached vacuum:
10-5 Pa




Initial vacuum 10-2 Pa
produced by rotary pump is

absolutely necessary



Vacuum system – diffusion pumpReached vacuum:10-5 Pa    Initial vacuum 10-2 Pa  produced by

Слайд 33Vacuum system – Ion Getter Pump
Gas molecules

are ionised by high voltage (5kV)
and absorbed

by the spongy surface of the titanium cathod


B There is no phenomenon of contamination

Vacuum system – Ion Getter Pump   Gas molecules are ionised by high voltage (5kV)

Слайд 34Vacuum system – Turbo Molecular Pump
It works on the

principle of centrifugal pump.
Thanks generated by the rotary

pump an initial vacuum, the turbine can reach very high ultrasonic speeds.
This causes the mechanical expulsion of the gas molecules.
There is no phenomenon of contamination.
Vacuum system – Turbo Molecular Pump  It works on the principle of centrifugal pump.  Thanks

Слайд 35Penning vacuum gauge
Vacuum glow gauge

The measure is the current vacuum

glow discharge
Electrodes are placed in the external permanent magnet, it

prevents stalling discharge.
Electrode head is applied high voltage (1000 - 2000V).
Is used in the pressure range from approx. 10-2 do 10-7 Pa

Penning vacuum gaugeVacuum glow gaugeThe measure is the current vacuum glow dischargeElectrodes are placed in the external

Слайд 36Penning vacuum gauge

Penning vacuum gauge

Слайд 37Pirani vacuum gauge
Vacuum thermal-conductive gauge.

The special wire end located in

the vacuum test is heated by electric current
When the vacuum

is better, the worse the heat is extracted from the wire, which increases its temperature. As a result, the wire resistance is increased.
applies to vacuum measurement in the range from 0,5 up to 10-3 Pa.
Pirani vacuum gaugeVacuum thermal-conductive gauge.The special wire end located in the vacuum test is heated by electric

Слайд 38Lens system forming image
Typically it consists of three, four or

five lenses:

Obiective Lens - OL
Intermediate lens - IL (one or

two)
Projection lens - PL, (one or two)
Lens system forming imageTypically it consists of three, four or five lenses:Obiective Lens - OLIntermediate lens -

Слайд 39Obiective lens
The lens of the greatest importance
Generates a first image

(original image)
In the back focal plane image is created diffraction
It

has the shortest focal length possible, to minimize spherical aberration coefficient
It comprises a device for correction of astigmatism
Obiective lensThe lens of the greatest importanceGenerates a first image (original image)In the back focal plane image

Слайд 40Obiective aperture
Improves contrast of final image

By changing the position of

this aperture we can get different types of images

Obiective apertureImproves contrast of final imageBy changing the position of this aperture we can get different types

Слайд 41Intermediate Lens
It enables to obtain:

magnification of initial image

diffraction pattern of

the selected area SAED

Intermediate LensIt enables to obtain:magnification of initial imagediffraction pattern of the selected area SAED

Слайд 42Diffraction aperture
Used to obtain a diffraction pattern of the selected

area - SAED

Diffraction apertureUsed to obtain a diffraction pattern of the selected area - SAED

Слайд 43Projector Lens
Used for the final magnification of image obrazu

Projector LensUsed for the final magnification of image obrazu

Слайд 44Registration of images
Visualization of the images is on the screen

coated with phosphor
The electrons falling on the screen, causing the

emission of photons of visible light and allow visual observation of images
Registration of images is possible on films or digital circuits CCD
Registration of imagesVisualization of the images is on the screen coated with phosphorThe electrons falling on the

Слайд 45CCD Camera

CCD Camera

Слайд 46Visualisation equipment

Visualisation equipment

Слайд 47Power Supply
To ensure production of appropriate voltages used for:
cathode

heating, accelerating movement of electrons,
excitation systems of lenses
powering auxiliary

system
Power Supply To ensure production of appropriate voltages used for:cathode heating, accelerating movement of electrons,excitation systems of

Слайд 48Control System

Control System

Слайд 49Control System

Control System

Слайд 50Control System

Control System

Слайд 51Control system

Control system

Слайд 52Effect of electron beam into a thin TEM sample

Effect of electron beam into a thin TEM sample

Слайд 53Scanning Transmission Microscope - STEM
Transmission electron microscope equipped with a

transmission detector further analyzes the passing electrons.
In STEM may also

include other detectors typical for SEM like: SE, BSE and X-ray
Advantages:
opportunity to observe specimens thicker than in the TEM
possibility to perform microanalysis by EDS or EELS
Scanning Transmission Microscope - STEMTransmission electron microscope equipped with a transmission detector further analyzes the passing electrons.In

Слайд 54Detectors

Detectors

Слайд 55HVTEM / HRTEM
HVTEM – High Voltage TEM HRTEM – High

Resolution TEM

Used for studies crystalline samples
It enables observation of atoms

and atomic planes
Zoom up to several million times
It enables observation of crystal structure, crystal defects, the interphase boundaries.
It enables testing of thicker samples
HVTEM / HRTEMHVTEM – High Voltage TEM  HRTEM – High Resolution TEMUsed for studies crystalline samplesIt

Слайд 56HVTEM/HRTEM

HVTEM/HRTEM

Слайд 57HVTEM
The amorphous carbon coated with sprayed Li4Ti5O12.

HVTEM  The amorphous carbon coated with sprayed Li4Ti5O12.

Слайд 58HVTEM
Atomic resolution

HVTEM  Atomic resolution

Слайд 59HVHRTEM
Atomic resolution:
Grain boundaries orientation
Interphase boundaries, subgrains, stacking faults, t

microtwins, polytype structure
Defects of atoms distribution inside crystallline and amorphous

phases

Gold particle on carbon film

HVHRTEM Atomic resolution:Grain boundaries orientationInterphase boundaries, subgrains, stacking faults, t microtwins, polytype structureDefects of atoms distribution inside

Слайд 60EDS – X-ray radiation
X-ray - formed in the electron

beam column takes an electron from an inner shell of

the atom in the test sample. His place is taken by an electron from a higher energy shell emitting quantum characteristic energy

The radiation energy is characteristic of the element

Possible chemical composition - microanalysis (detection of elements)

EDS –  X-ray radiationX-ray - formed in the electron beam column takes an electron from an

Слайд 61Energy Distribution Spectrum - EDS

Energy Distribution Spectrum - EDS

Слайд 62EELS – Electron Energy Loss Spectroscopy
Spectroscopy (EELS) - is based

on the analysis of the energy distribution of scattered electrons.

With such a collision the electron loses some part of their kinetic energy - the energy of the primary electrons E0 is reduced by the value characteristic for the material
It is possible microanalysis chemical composition.
The EELS spectrometer is placed under the screen
EELS –  Electron Energy Loss SpectroscopySpectroscopy (EELS) - is based on the analysis of the energy

Слайд 63Detector EELS

Detector EELS

Слайд 64EELS - equipment

EELS - equipment

Слайд 65The influence of the sample thickness on research capabilities TEM

The influence of the sample thickness on research capabilities TEM

Слайд 66Selected Area Electron Diffraction
The need to remove the contrast aperture
Changing

the current excitation of the intermediate and projection lenses
Introduction selection

aperture - SA
Selected Area Electron DiffractionThe need to remove the contrast apertureChanging the current excitation of the intermediate and

Слайд 67Diffraction image formation
Mikrodiffraction (SAED – selected area electron diffraction )


– minimal diameter of diffraction surface is 1μm

Nanodiffraction
(CBED – convergent

beam electron diffraction) – diameter of diffraction surface is less than 100nm

Diffraction image formation Mikrodiffraction (SAED – selected area electron diffraction )  – minimal diameter of diffraction

Слайд 68Electron Diffraction – Bragg’s model
Bragg’s condition for electron beam

diffraction

nλ=2dsinθ

During the interaction of the electron

beam with a sample of the crystalline structure, below the sample is receive the primary beam and the diffracted beams as much as lattice planes with various plane indices hkl satisfies the Bragg equation
Electron Diffraction – Bragg’s model  Bragg’s condition for electron beam diffraction    nλ=2dsinθDuring the

Слайд 69Geometry of electron diffraction in TEM
Location reflections with respect to

the central point indicates the orientation reflected planes (hkl) -

vectors connecting track beam indomitable successive reflections are perpendicular to the planes, and their length is inversely proportional to the spacings

r = L ·tg2θ

r = L·λ/d

λL – constant of microscope
Geometry of electron diffraction in TEM Location reflections with respect to the central point indicates the orientation

Слайд 70Interpretation of electron diffraction patterns
Identification of the structure of the

investigated crystal from which the reflections were formed
Indexing (specify indexes

of atom planes)
Crystallographic analysis based on the diffraction image (SAED)
Applying the structure of the sample on the basis of the shape of elementary lattice and intensity of reflections
Interpretation of electron diffraction patternsIdentification of the structure of the investigated crystal from which the reflections were

Слайд 71Application of electron diffraction in materials investigation
Diffraction studies enable the

identification of the observed phase
Identification of a polycrystal on the

basis of the diffraction pattern is compared with the calculated measurement of the interplanar spacings with values contained in the databases of crystallographic data and determining the indices indices of {hkl} atom planes forming a diffraction pattern
In the case of a single crystal identification is a comprehensive solution diffraction pattern - defining indexes of atomic planes (hkl), zone axis [uvw] and their mutual crystallographic orientation
Application of electron diffraction in materials investigationDiffraction studies enable the identification of the observed phaseIdentification of a

Слайд 72Examples of diffraction patterns

Examples of diffraction patterns

Слайд 73Examples of TEM investigation
Mikrostructure of low alloyed steel

Examples of TEM investigationMikrostructure of low alloyed steel

Слайд 74Imperfections in the crystal structure (dislocations and grain boundary between

the two polycrystal).
Image obtained by TEM.

Imperfections in the crystal structure (dislocations and grain boundary between the two polycrystal).Image obtained by TEM.

Слайд 75Martensite inside structure of steel 35SG grade

Martensite inside structure of steel 35SG grade

Слайд 76Dislocations and grain boundaries in chromium – molybdenum steel

Dislocations and grain boundaries in chromium – molybdenum steel

Слайд 77Structure of the two-phase polymer

Structure of the two-phase polymer

Слайд 78https://www.youtube.com/watch?v=iiJuG636PfQ

https://www.youtube.com/watch?v=iiJuG636PfQ

Слайд 79Hitachi

Hitachi

Слайд 81Literatura
G. Schimmel, Metodyka mikroskopii elektronowej, PWN, Warszawa 1976
Ian M. Wat,

The principles and practice of electron microscopy, second edition, Cambridge

University Press, 1997
Peter J. Goodhew, John Humphreys, Richard Beanland, Electron microscophy and analysis, third edition, Taylor & Francis Inc, London 2001
Andrzej Barbacki, Mikroskopia elektronowa, Wydawnictwo Politechniki Poznańskiej, Poznań 2005
Leszek A. Dobrzański, Eugeniusz Hajduczek, Mikroskopia świetlna i elektronowa, Wydawnictwa Naukowo-Techniczne, Warszawa 1987
Pod red. W. Dudzińskiego, Materiały konstrukcyjne w budowie maszyn, Oficyna Wydawnicza Politechniki Wrocławskiej, Wrocław 1994
Jan Kozubowski, Metody transmisyjnej mikroskopii elektronowej, Wydawnictwo Śląsk, Katowice 1975
Ludwig Reimer, Transmission Electron Microscopy, Spinger Verlag, Berlin-Heidelberg-New York-Tokyo 1984

LiteraturaG. Schimmel, Metodyka mikroskopii elektronowej, PWN, Warszawa 1976Ian M. Wat, The principles and practice of electron microscopy,

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